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Kevin Byrd

Intel

4

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Low Temperature Solder - A Breakthrough Technology for Surface Mounted Devices

2018 ECTC | Electronic Components and Technology Conference
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iNEMI project on process development of BiSn-based low temperature solder pastes: Part III: Mechanical shock tests on POP BGA assemblies

2018 ICEP | International Conference on Electronics Packaging
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Measurement and modeling of in situ lead stiffness of surface mounted packages

1991 ECTC | Electronic Components and Technology Conference
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Experimental measurements of surface mount component lead stiffness

1990 ECTC | Electronic Components and Technology Conference
- D.E. Pope
- Kevin Byrd
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Citations (2)