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Jagadeesh Radhakrishnan
Jagadeesh Radhakrishnan
Intel
Materials science
Soldering
Ball grid array
Composite material
Eutectic system
5
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14
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Post Mechanical Shock Test Failure Analysis on Mixed SnAgCu-BiSn BGA Solder Joints
2021
ICEP | International Conference on Electronics Packaging
Raiyo Aspandiar
K. Murayama
P. Goonetilleke
Jagadeesh Radhakrishnan
Haley Fu
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iNEMI project on process development of BiSn-based low temperature solder pastes: Part III: Mechanical shock tests on POP BGA assemblies
2018
ICEP | International Conference on Electronics Packaging
Haley Fu
Jagadeesh Radhakrishnan
Morgana Ribas
Raiyo Aspandiar
Kevin Byrd
Jimmy Chen
Shunfeng Cheng
Qin Chen
Richard Coyle
Sophia Feng
Mark Krmpotich
Scott Mokler
Brook Sandy-Smith
Kok Kwan Tang
Greg Wu
Anny Zhang
Wilson Zhen
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iNEMI project on process development of BISN-based low temperature solder pastes — Part II: Characterization of mixed alloy BGA solder joints
2018
Haley Fu
Raiyo Aspandiar
Jimmy Chen
Shunfeng Cheng
Qin Chen
Richard Coyle
Sophia Feng
Bill Hardin
Mark Krmpotich
Scott Mokler
Jagadeesh Radhakrishnan
Morgana Ribas
Brook Sandy-Smith
Kok Kwan Tang
Greg Wu
Anny Zhang
Wilson Zhen
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Citations (5)
The Characterization of Damage Propagation of BGA Flip-Chip Electronic Packages Under Mechanical Shock Loading
2009
Kayleen L. E. Helms
Ketan R. Shah
Dan H. Gerbus
Vasu Vasudevan
Jagadeesh Radhakrishnan
William E. Berry
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Effect of board and package attributes on solder joint reliability of FCBGA packages based on IPC9701 characterization
2008
ECTC | Electronic Components and Technology Conference
Jagadeesh Radhakrishnan
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Citations (3)
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