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Shunfeng Cheng
Shunfeng Cheng
Intel
Soldering
Forensic engineering
Materials science
Metallurgy
Printed circuit board
5
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190
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iNEMI project on process development of BiSn-based low temperature solder pastes: Part III: Mechanical shock tests on POP BGA assemblies
2018
ICEP | International Conference on Electronics Packaging
Haley Fu
Jagadeesh Radhakrishnan
Morgana Ribas
Raiyo Aspandiar
Kevin Byrd
Jimmy Chen
Shunfeng Cheng
Qin Chen
Richard Coyle
Sophia Feng
Mark Krmpotich
Scott Mokler
Brook Sandy-Smith
Kok Kwan Tang
Greg Wu
Anny Zhang
Wilson Zhen
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Citations (5)
Physics-of-Failure Approach to PHM
2018
Shunfeng Cheng
Nagarajan Raghavan
Jie Gu
Sony Mathew
Michael Pecht
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Citations (2)
iNEMI project on process development of BISN-based low temperature solder pastes — Part II: Characterization of mixed alloy BGA solder joints
2018
Haley Fu
Raiyo Aspandiar
Jimmy Chen
Shunfeng Cheng
Qin Chen
Richard Coyle
Sophia Feng
Bill Hardin
Mark Krmpotich
Scott Mokler
Jagadeesh Radhakrishnan
Morgana Ribas
Brook Sandy-Smith
Kok Kwan Tang
Greg Wu
Anny Zhang
Wilson Zhen
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Citations (5)
A review of lead-free solders for electronics applications
2017
Microelectronics Reliability
Shunfeng Cheng
Chien-Ming Huang
Michael Pecht
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Citations (178)
Failure Causes of a Polymer Resettable CircuitProtection Device
2012
Journal of Electronic Materials
Shunfeng Cheng
Kwok Tom
Michael Pecht
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