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Scott Mokler
Scott Mokler
Intel
Soldering
Materials science
Ball grid array
Brittleness
Solder paste
4
Papers
15
Citations
0
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Low Temperature Solder - A Breakthrough Technology for Surface Mounted Devices
2018
ECTC | Electronic Components and Technology Conference
Shubhada H. Sahasrabudhe
Scott Mokler
Mukul Renavikar
Sandeep Sane
Kevin Byrd
Eric Brigham
Owen Jin
Pubudu Goonetilleke
Nilesh Badwe
Satish Parupalli
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iNEMI project on process development of BiSn-based low temperature solder pastes: Part III: Mechanical shock tests on POP BGA assemblies
2018
ICEP | International Conference on Electronics Packaging
Haley Fu
Jagadeesh Radhakrishnan
Morgana Ribas
Raiyo Aspandiar
Kevin Byrd
Jimmy Chen
Shunfeng Cheng
Qin Chen
Richard Coyle
Sophia Feng
Mark Krmpotich
Scott Mokler
Brook Sandy-Smith
Kok Kwan Tang
Greg Wu
Anny Zhang
Wilson Zhen
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Recess in the motherboard architectures for small form factor systems
2018
Tim Swettlen
Juan Landeros
Scott Mokler
Antonio Caputo
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iNEMI project on process development of BISN-based low temperature solder pastes — Part II: Characterization of mixed alloy BGA solder joints
2018
Haley Fu
Raiyo Aspandiar
Jimmy Chen
Shunfeng Cheng
Qin Chen
Richard Coyle
Sophia Feng
Bill Hardin
Mark Krmpotich
Scott Mokler
Jagadeesh Radhakrishnan
Morgana Ribas
Brook Sandy-Smith
Kok Kwan Tang
Greg Wu
Anny Zhang
Wilson Zhen
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Citations (5)
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