Low Temperature Solder - A Breakthrough Technology for Surface Mounted Devices

Intel's commitment to the environment continues with a breakthrough technology – Low Temperature Solder for Surface Mounted Devices. In this paper we will introduce the technology and its benefits to PC and electronic device manufacturers. We will also discuss the process, material, design optimization efforts performed in order to ensure Yield, Quality and Reliability goals are met. Manufacturability and mechanical/ thermomechanical solder joint reliability data will be shared to demonstrate the impact of key technical modulators.