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Richard Coyle
Richard Coyle
Nokia
Soldering
Ball grid array
Brittleness
Solder paste
Composite material
2
Papers
10
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0
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iNEMI project on process development of BiSn-based low temperature solder pastes: Part III: Mechanical shock tests on POP BGA assemblies
2018
ICEP | International Conference on Electronics Packaging
Haley Fu
Jagadeesh Radhakrishnan
Morgana Ribas
Raiyo Aspandiar
Kevin Byrd
Jimmy Chen
Shunfeng Cheng
Qin Chen
Richard Coyle
Sophia Feng
Mark Krmpotich
Scott Mokler
Brook Sandy-Smith
Kok Kwan Tang
Greg Wu
Anny Zhang
Wilson Zhen
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Citations (5)
iNEMI project on process development of BISN-based low temperature solder pastes — Part II: Characterization of mixed alloy BGA solder joints
2018
Haley Fu
Raiyo Aspandiar
Jimmy Chen
Shunfeng Cheng
Qin Chen
Richard Coyle
Sophia Feng
Bill Hardin
Mark Krmpotich
Scott Mokler
Jagadeesh Radhakrishnan
Morgana Ribas
Brook Sandy-Smith
Kok Kwan Tang
Greg Wu
Anny Zhang
Wilson Zhen
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Citations (5)
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