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J.J. Maloney
J.J. Maloney
IBM
Chip-scale package
Electronic engineering
Engineering
Quad Flat No-leads package
Materials science
4
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16
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Packaging the Cell Broadband Engine microprocessor for supercomputer applications
2008
ECTC | Electronic Components and Technology Conference
Paul M. Harvey
Rohan Mandrekar
Yaping Zhou
Jiantao Zheng
J.J. Maloney
Steve R. Cain
Kazushige Kawasaki
Gary LaFontant
Hirokazu Noma
K. Imming
T. Plachy
David L. Questad
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BondPadOptimization forCMOS ImagerwithChipScale Package
2006
International Symposium on the Physical and Failure Analysis of Integrated Circuits
Richard J. Rassel
W. Guthrie
J. Gambino
J.J. Maloney
M. Stidham
Edmund J. Sprogis
James W. Adkisson
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Bond Pad Optimization for CMOS Imager with Chip Scale Package
2006
IPFA | International Symposium on the Physical and Failure Analysis of Integrated Circuits
Richard J. Rassel
W. Guthrie
J. Gambino
J.J. Maloney
M. Stidham
Edmund J. Sprogis
James W. Adkisson
Mark D. Jaffe
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Stacked-chip packaging: electrical, mechanical, and thermal challenges
2004
ECTC | Electronic Components and Technology Conference
Elie Awad
Hanyi Ding
R.S. Graf
J.J. Maloney
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Citations (12)
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