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W. Guthrie
W. Guthrie
IBM
Electronic engineering
Chip-scale package
interconnect technology
Interconnection
Electrical engineering
3
Papers
3
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0
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Reliability of segmented edge seal ring for RF devices
2014
IITC | International Interconnect Technology Conference
J. Gambino
R.S. Graf
J. Malinowski
A. Cote
W. Guthrie
Kimball M. Watson
Phillip Francis Chapman
K.K. Sims
Mark D. Levy
Toyohiro Aoki
G.A. Mason
Mark D. Jaffe
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Citations (3)
BondPadOptimization forCMOS ImagerwithChipScale Package
2006
International Symposium on the Physical and Failure Analysis of Integrated Circuits
Richard J. Rassel
W. Guthrie
J. Gambino
J.J. Maloney
M. Stidham
Edmund J. Sprogis
James W. Adkisson
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Bond Pad Optimization for CMOS Imager with Chip Scale Package
2006
IPFA | International Symposium on the Physical and Failure Analysis of Integrated Circuits
Richard J. Rassel
W. Guthrie
J. Gambino
J.J. Maloney
M. Stidham
Edmund J. Sprogis
James W. Adkisson
Mark D. Jaffe
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