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R.S. Graf
R.S. Graf
IBM
Materials science
Electronic engineering
Quad Flat No-leads package
Chip-scale package
Modeling and simulation
2
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15
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Reliability of segmented edge seal ring for RF devices
2014
IITC | International Interconnect Technology Conference
J. Gambino
R.S. Graf
J. Malinowski
A. Cote
W. Guthrie
Kimball M. Watson
Phillip Francis Chapman
K.K. Sims
Mark D. Levy
Toyohiro Aoki
G.A. Mason
Mark D. Jaffe
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Citations (3)
Stacked-chip packaging: electrical, mechanical, and thermal challenges
2004
ECTC | Electronic Components and Technology Conference
Elie Awad
Hanyi Ding
R.S. Graf
J.J. Maloney
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Citations (12)
1