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Steve R. Cain
Steve R. Cain
IBM
Composite material
Eutectic system
Metallurgy
Soldering
Tin
3
Papers
82
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Packaging the Cell Broadband Engine microprocessor for supercomputer applications
2008
ECTC | Electronic Components and Technology Conference
Paul M. Harvey
Rohan Mandrekar
Yaping Zhou
Jiantao Zheng
J.J. Maloney
Steve R. Cain
Kazushige Kawasaki
Gary LaFontant
Hirokazu Noma
K. Imming
T. Plachy
David L. Questad
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Citations (4)
Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents
2004
ECTC | Electronic Components and Technology Conference
Sung K. Kang
Paul A. Lauro
Da-Yuan Shih
Donald W. Henderson
Timothy A. Gosselin
Jay Bartelo
Steve R. Cain
Charles Goldsmith
Karl J. Puttlitz
Tae-Kyung Hwang
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Citations (42)
The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints
2004
Materials Transactions
Sung K. Kang
Paul A. Lauro
Da-Yuan Shih
Donald W. Henderson
Jay Bartelo
Timothy A. Gosselin
Steve R. Cain
Charles Goldsmith
Karl J. Puttlitz
Tae K. Hwang
Won Kyoung Choi
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Citations (36)
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