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M. Stidham
M. Stidham
IBM
Chip-scale package
Electronic engineering
interconnect technology
Interconnection
Dielectric
2
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BondPadOptimization forCMOS ImagerwithChipScale Package
2006
International Symposium on the Physical and Failure Analysis of Integrated Circuits
Richard J. Rassel
W. Guthrie
J. Gambino
J.J. Maloney
M. Stidham
Edmund J. Sprogis
James W. Adkisson
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Bond Pad Optimization for CMOS Imager with Chip Scale Package
2006
IPFA | International Symposium on the Physical and Failure Analysis of Integrated Circuits
Richard J. Rassel
W. Guthrie
J. Gambino
J.J. Maloney
M. Stidham
Edmund J. Sprogis
James W. Adkisson
Mark D. Jaffe
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