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Jiantao Zheng
Jiantao Zheng
IBM
Electronic engineering
Engineering
Mechanical engineering
Materials science
Ball grid array
5
Papers
12
Citations
0
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Mechanical Stress Analysis and Evaluation of Hybrid Land Grid Array Attached Large Form Factor Organic Modules
2012
John G. Torok
Shawn Canfield
Yuet-Ying Yu
Jiantao Zheng
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SEISMIC TESTING AND ANALYSIS OF MAIN FRAME COMPUTER STRUCTURE
2012
Budy D. Notohardjono
Richard M. Ecker
Jiantao Zheng
John G. Torok
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Improved cooling of housings for three-dimensionally stacked chips
2011
Gerald Keith Bartley
Jamil A. Wakil
Xiaojin Wei
David Roy Motschman
Kamal K. Sikka
Jiantao Zheng
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Delamination mechanisms of thermal interface materials in organic packages during reflow and moisture soaking
2009
ECTC | Electronic Components and Technology Conference
Jiantao Zheng
Virendra R. Jadhav
Jamil A. Wakil
Jeffrey T. Coffin
Sushumna Iruvanti
Richard Langlois
Ed ward Yarmchuk
Michael A. Gaynes
Hsichang Liu
Kamal K. Sikka
Peter J. Brofman
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Packaging the Cell Broadband Engine microprocessor for supercomputer applications
2008
ECTC | Electronic Components and Technology Conference
Paul M. Harvey
Rohan Mandrekar
Yaping Zhou
Jiantao Zheng
J.J. Maloney
Steve R. Cain
Kazushige Kawasaki
Gary LaFontant
Hirokazu Noma
K. Imming
T. Plachy
David L. Questad
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Citations (4)
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