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Paolo Colombo
Paolo Colombo
STMicroelectronics
Electrical engineering
Electronic engineering
Engineering
Microcontroller
Chip
5
Papers
15
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0
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Effects of the On-Die Decoupling Capacitors on the EME Performance in 28 nm FD-SOI Technology
2019
Mario Rotigni
Mauro Merlo
Aurora Sanna
Paolo Colombo
Renato Castellan
Valentino Liberali
Andrea Barletta
Roberto DeChecchi
Kristoffer Sander Skytte
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Conducted emissions in a 40 nm CMOS test chip: The role of the ESD protections
2017
Mario Rotigni
Mauro Merlo
Martina Cordoni
Paolo Colombo
Valentino Liberali
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Role of IC substrate and ESD protections in noise propagation: Design and modelling of dedicated test chip in 40 nm technology
2015
Mario Rotigni
Mauro Merlo
Martina Cordoni
Paolo Colombo
Valentino Liberali
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Investigation of product burn-in failures due to powered NPN bipolar latching of active MOSFET rail clamps
2013
EOS/ESD | Electrical Overstress/Electrostatic Discharge Symposium
Scott Ruth
James W. Miller
Alex Gerdemann
Michael Stockinger
Melanie Etherton
M. Moosa
Allan Dobbin
Robert Mertens
Kuo Hsuan Meng
Elyse Rosenbaum
Paolo Colombo
Martina Cordoni
Nicolas Guitard
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Citations (10)
Method and device for improving the properties of ESD protection for semiconductor integrated circuits
1997
Paolo Colombo
Emilio Camerlenghi
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