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P. Goonetilleke
P. Goonetilleke
Intel
Solderability
Intermetallic
Soldering
Shock (mechanics)
Flip chip
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Post Mechanical Shock Test Failure Analysis on Mixed SnAgCu-BiSn BGA Solder Joints
2021
ICEP | International Conference on Electronics Packaging
Raiyo Aspandiar
K. Murayama
P. Goonetilleke
Jagadeesh Radhakrishnan
Haley Fu
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