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Yoshihito Mizutani
Yoshihito Mizutani
Composite material
Soldering
Materials science
Three-dimensional integrated circuit
Thermocompression bonding
4
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36
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Multi-chip gang bonding technology using the thermo-compression bonder for Si substrate
2018
ICEP | International Conference on Electronics Packaging
Noboru Asahi
Yoshihito Mizutani
Koichi Imai
Hiroto Tanaka
Yasunori Hashimoto
Toshiyuki Jinda
Mikio Kawakami
Katsumi Terada
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3D-IC thermo-compression collective bonding process using high temperature stage
2017
ICEP | International Conference on Electronics Packaging
Noboru Asahi
Yoshihito Mizutani
Koichi Imai
Yasunori Hashimoto
Hikaru Tomita
Toshiyuki Jinda
Mikio Kawakami
Masafumi Senda
Katsumi Terada
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High Accuracy Thermal Compression Bonding Technology for Large-Sized Substrate
2017
ECTC | Electronic Components and Technology Conference
Noboru Asahi
Yoshihito Mizutani
Koichi Imai
Yasunori Hashimoto
Hikaru Tomita
Toshiyuki Jinda
Mikio Kawakami
Masafumi Senda
Katsumi Terada
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Citations (4)
High productivity thermal compression bonding for 3D-IC
2015
DIC | IEEE International D Systems Integration Conference
Noboru Asahi
Yoshinori Miyamoto
Masatsugu Nimura
Yoshihito Mizutani
Yoshiyuki Arai
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Citations (26)
1