Old Web
English
Sign In
Acemap
>
authorDetail
>
Toshiyuki Jinda
Toshiyuki Jinda
Materials science
Composite material
Soldering
Wafer
Chip
5
Papers
10
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (5)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Collective and Gang Bonding for Three-Dimensional Integrated Circuits in Chip-on-Wafer Process
2019
DIC | IEEE International D Systems Integration Conference
Hiroto Tanaka
Yoshiyuki Arai
Toshiyuki Jinda
Noboru Asahi
Katsumi Terada
Show All
Source
Cite
Save
Citations (0)
Multi-chip gang bonding technology using the thermo-compression bonder for Si substrate
2018
ICEP | International Conference on Electronics Packaging
Noboru Asahi
Yoshihito Mizutani
Koichi Imai
Hiroto Tanaka
Yasunori Hashimoto
Toshiyuki Jinda
Mikio Kawakami
Katsumi Terada
Show All
Source
Cite
Save
Citations (1)
DISPOSITIF DE FABRICATION D'UN DISPOSITIF À SEMI-CONDUCTEUR ET PROCÉDÉ DE FABRICATION D'UN DISPOSITIF À SEMI-CONDUCTEUR
2018
Noboru Asahi
chaorisheng
Katsumi Terada
terada katumi
Toshiyuki Jinda
zin ta tosiyuki
Masafumi Senda
Qiantianya Shi
Show All
Source
Cite
Save
Citations (0)
3D-IC thermo-compression collective bonding process using high temperature stage
2017
ICEP | International Conference on Electronics Packaging
Noboru Asahi
Yoshihito Mizutani
Koichi Imai
Yasunori Hashimoto
Hikaru Tomita
Toshiyuki Jinda
Mikio Kawakami
Masafumi Senda
Katsumi Terada
Show All
Source
Cite
Save
Citations (5)
High Accuracy Thermal Compression Bonding Technology for Large-Sized Substrate
2017
ECTC | Electronic Components and Technology Conference
Noboru Asahi
Yoshihito Mizutani
Koichi Imai
Yasunori Hashimoto
Hikaru Tomita
Toshiyuki Jinda
Mikio Kawakami
Masafumi Senda
Katsumi Terada
Show All
Source
Cite
Save
Citations (4)
1