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Masafumi Senda
Masafumi Senda
Materials science
Composite material
Soldering
Electronic engineering
Distortion
4
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9
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DISPOSITIF DE FABRICATION D'UN DISPOSITIF À SEMI-CONDUCTEUR ET PROCÉDÉ DE FABRICATION D'UN DISPOSITIF À SEMI-CONDUCTEUR
2018
Noboru Asahi
chaorisheng
Katsumi Terada
terada katumi
Toshiyuki Jinda
zin ta tosiyuki
Masafumi Senda
Qiantianya Shi
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DISPOSITIF DE MONTAGE ET PROCÉDÉ DE MONTAGE
2018
Katsumi Terada
terada katumi
Masafumi Senda
Qiantianya Shi
Yuki Mashimo
masita yuuki
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3D-IC thermo-compression collective bonding process using high temperature stage
2017
ICEP | International Conference on Electronics Packaging
Noboru Asahi
Yoshihito Mizutani
Koichi Imai
Yasunori Hashimoto
Hikaru Tomita
Toshiyuki Jinda
Mikio Kawakami
Masafumi Senda
Katsumi Terada
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High Accuracy Thermal Compression Bonding Technology for Large-Sized Substrate
2017
ECTC | Electronic Components and Technology Conference
Noboru Asahi
Yoshihito Mizutani
Koichi Imai
Yasunori Hashimoto
Hikaru Tomita
Toshiyuki Jinda
Mikio Kawakami
Masafumi Senda
Katsumi Terada
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Citations (4)
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