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Hikaru Tomita
Hikaru Tomita
Composite material
Soldering
Materials science
Electronic engineering
Booster (rocketry)
3
Papers
9
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0
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2024
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3D-IC thermo-compression collective bonding process using high temperature stage
2017
ICEP | International Conference on Electronics Packaging
Noboru Asahi
Yoshihito Mizutani
Koichi Imai
Yasunori Hashimoto
Hikaru Tomita
Toshiyuki Jinda
Mikio Kawakami
Masafumi Senda
Katsumi Terada
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Citations (5)
High Accuracy Thermal Compression Bonding Technology for Large-Sized Substrate
2017
ECTC | Electronic Components and Technology Conference
Noboru Asahi
Yoshihito Mizutani
Koichi Imai
Yasunori Hashimoto
Hikaru Tomita
Toshiyuki Jinda
Mikio Kawakami
Masafumi Senda
Katsumi Terada
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Citations (4)
Conceptual study of fly-back booster
1992
Hikaru Tomita
Kouichi Yonemoto
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