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Jae-gwon Jang
Jae-gwon Jang
Samsung
Computer science
Embedded system
Reliability (semiconductor)
Wafer-scale integration
Interposer
2
Papers
1
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0
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Novel 2.5D RDL Interposer Packaging: A Key Enabler for the New Era of Heterogenous Chip Integration
2021
ECTC | Electronic Components and Technology Conference
Min Jung Kim
Seok-hyun Lee
Kyoung-lim Suk
Jae-gwon Jang
Jeon Gwangjae
Ju-Il Choi
Hyo-Jin Yun
Jongpa Hong
Ju-Yeon Choi
Wonjae Lee
Sukhyun Jung
Won Kyoung Choi
Dae-Woo Kim
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Advanced RDL Interposer PKG Technology for Heterogeneous Integration
2020
Jae-gwon Jang
Kyoung-lim Suk
Seok-hyun Lee
Jin-woo Park
Gwang-jae Jeon
Park Jungho
Jeong-Gi Jin
Su-chang Lee
Gyoungbum Kim
Joo-yeon Choi
Dae-Woo Kim
Dan Oh
Won Kyoung Choi
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