Old Web
English
Sign In
Acemap
>
authorDetail
>
Gyoungbum Kim
Gyoungbum Kim
Samsung
Computer science
Interposer
System in package
Embedded system
Redistribution layer
4
Papers
2
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (4)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Chip/Package Co-Design Analysis of Advanced D2D Interface Using a Statistical Link Simulator
2021
ECTC | Electronic Components and Technology Conference
Sang Wook Park
Heewoo An
Jeon Seong-Hwan
Gyoungbum Kim
Dan Kyung Suk Oh
Show All
Source
Cite
Save
Citations (0)
Cost Effective 2.3D Packaging Solution by using Fanout Panel Level RDL
2021
ECTC | Electronic Components and Technology Conference
Joon-Sung Kim
Jae-Hoon Choi
Sang-Uk Kim
Jooyoung Choi
Yongjin Park
Gyoungbum Kim
Sangyu Kim
Sang Wook Park
Hwasub Oh
Seok-Won Lee
Tae-Je Cho
Dong-Wook Kim
Show All
Source
Cite
Save
Citations (1)
Solving Power Integrity Challenges for Smart Computing Era
2021
ECTC | Electronic Components and Technology Conference
Manho Lee
Eun-Seok Song
Gyoungbum Kim
Dan Kyung Suk Oh
Show All
Source
Cite
Save
Citations (0)
Advanced RDL Interposer PKG Technology for Heterogeneous Integration
2020
Jae-gwon Jang
Kyoung-lim Suk
Seok-hyun Lee
Jin-woo Park
Gwang-jae Jeon
Park Jungho
Jeong-Gi Jin
Su-chang Lee
Gyoungbum Kim
Joo-yeon Choi
Dae-Woo Kim
Dan Oh
Won Kyoung Choi
Show All
Source
Cite
Save
Citations (1)
1