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Jongpa Hong
Jongpa Hong
Samsung
Materials science
Packaging engineering
Light-emitting diode
Metalorganic vapour phase epitaxy
Electronic engineering
3
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Process optimization of micro bump pitch design in 3-dimensional package structure
2021
ECTC | Electronic Components and Technology Conference
Sun-Jae Kim
Hyo-Eun Kim
Jongpa Hong
Ohguk Kwon
Hyoungjoo Lee
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Novel 2.5D RDL Interposer Packaging: A Key Enabler for the New Era of Heterogenous Chip Integration
2021
ECTC | Electronic Components and Technology Conference
Min Jung Kim
Seok-hyun Lee
Kyoung-lim Suk
Jae-gwon Jang
Jeon Gwangjae
Ju-Il Choi
Hyo-Jin Yun
Jongpa Hong
Ju-Yeon Choi
Wonjae Lee
Sukhyun Jung
Won Kyoung Choi
Dae-Woo Kim
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Multiphysics modeling and design of ultralarge multiwafer MOVPE reactor for group III-nitride light emitting diodes
2010
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Changsung Sean Kim
Jongpa Hong
Jihye Shim
Yongsun Won
Yong-Il Kwon
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