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Su-chang Lee
Su-chang Lee
Samsung
Interposer
Reliability (semiconductor)
Substrate (building)
Chip
Materials science
3
Papers
1
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0
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2024
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The Extremely Large 2.5D Molded Interposer on Substrate (MIoS) Package Integration - Warpage and Reliability
2021
ECTC | Electronic Components and Technology Conference
Soohyun Nam
Young Lyong Kim
Aeni Jang
Inhyo Hwang
Sungwoo Park
Su-chang Lee
Dae-Woo Kim
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Novel method of wafer-level and package-level process simulation for warpage optimization of 2.5D TSV
2021
ECTC | Electronic Components and Technology Conference
Su-chang Lee
Sun woo Han
Jong-pa Hong
Sang kun O
Dong-Ok Kwak
Soohyun Nam
Park Yu-Kyung
Jong-ho Lee
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Advanced RDL Interposer PKG Technology for Heterogeneous Integration
2020
Jae-gwon Jang
Kyoung-lim Suk
Seok-hyun Lee
Jin-woo Park
Gwang-jae Jeon
Park Jungho
Jeong-Gi Jin
Su-chang Lee
Gyoungbum Kim
Joo-yeon Choi
Dae-Woo Kim
Dan Oh
Won Kyoung Choi
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