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Ju-Il Choi
Ju-Il Choi
Samsung
Wafer-level packaging
Chip
Wafer-scale integration
Diffusion barrier
Wafer
2
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Novel Approach to Highly Robust Fine Pitch RDL Process
2021
ECTC | Electronic Components and Technology Conference
Ju-Il Choi
Jeongi Jin
Gyuho Kang
Hyunsu Hwang
Byungchan Kim
Hyo-Jin Yun
Jum-Yong Park
Chung-Sun Lee
Un byoung Kang
Jong-ho Lee
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Novel 2.5D RDL Interposer Packaging: A Key Enabler for the New Era of Heterogenous Chip Integration
2021
ECTC | Electronic Components and Technology Conference
Min Jung Kim
Seok-hyun Lee
Kyoung-lim Suk
Jae-gwon Jang
Jeon Gwangjae
Ju-Il Choi
Hyo-Jin Yun
Jongpa Hong
Ju-Yeon Choi
Wonjae Lee
Sukhyun Jung
Won Kyoung Choi
Dae-Woo Kim
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