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Michael Huang
Michael Huang
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Electronic engineering
Engineering
Dielectric
Stress field
Radial stress
5
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30
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Reliability Study of Large Fan-Out BGA Solution on FinFET Process
2018
ECTC | Electronic Components and Technology Conference
C.K. Yu
W.S. Chiang
P.-S. Huang
M. Z. Lin
Y. H. Fang
M. J. Lin
Cooper Peng
Benson Lin
Michael Huang
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Citations (5)
A unique failure mechanism induced by chip to board interaction on fan-out wafer level package
2017
IRPS | International Reliability Physics Symposium
C.K. Yu
W.S. Chiang
N. W. Liu
M. Z. Lin
Y. H. Fang
M. J. Lin
Benson Lin
Michael Huang
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Citations (7)
Thermal resistance modeling of back-end interconnect and intrinsic FinFETs, and transient simulation of inverters with capacitive loading effects
2016
IEDM | International Electron Devices Meeting
Jhih-Yang Yan
Sun-Rong Jan
Yu-Jiun Peng
H. H. Lin
W. K. Wan
Y.-H. Huang
Bigchoug Hung
K.-T. Chan
Michael Huang
M.T. Yang
C. W. Liu
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Citations (13)
Compact modeling and simulation of TSV with experimental verification
2016
VLSIT | Symposium on VLSI Technology
Jhih-Yang Yan
Sun-Rong Jan
Yi-Chung Huang
Huang-Siang Lan
C. W. Liu
Y.-H. Huang
Bigchoug Hung
K.-T. Chan
Michael Huang
M.T. Yang
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Citations (1)
Asymmetric Keep-Out Zone of Through-Silicon Via Using 28-nm Technology Node
2015
IEEE Electron Device Letters
Jhih-Yang Yan
Sun-Rong Jan
Yi-Chung Huang
Huang-Siang Lan
Y.-H. Huang
Bigchoug Hung
K.-T. Chan
Michael Huang
M.T. Yang
C. W. Liu
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Citations (4)
1