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N. W. Liu
N. W. Liu
MediaTek
Electronic engineering
Redistribution layer
Wafer
Soldering
Drop test
3
Papers
9
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Reliability Investigation of Extremely Large Ratio Fan-Out Wafer-Level Package with Low Ball Density for Ultra-Short-Range Radar
2019
ECTC | Electronic Components and Technology Conference
P.S. Huang
C.K. Yu
W.S. Chiang
M. Z. Lin
Y. H. Fang
M. J. Lin
N. W. Liu
Benson Lin
Ian Hsu
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Citations (1)
Study of Board Level Reliability of eWLB (embedded Wafer Level BGA) for 0.35mm Ball Pitch
2019
ECTC | Electronic Components and Technology Conference
Kang Hai Lee
Yeow Kheng Lim
Seng Guan Chow
Kang Chen
Won-Kyung Choi
Seung Wook Yoon
N. W. Liu
Yenyao Chi
Benson Lin
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A unique failure mechanism induced by chip to board interaction on fan-out wafer level package
2017
IRPS | International Reliability Physics Symposium
C.K. Yu
W.S. Chiang
N. W. Liu
M. Z. Lin
Y. H. Fang
M. J. Lin
Benson Lin
Michael Huang
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Citations (7)
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