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P. J. Holverson
P. J. Holverson
Electronic engineering
Engineering
Spark plug
Optoelectronics
high pressure
5
Papers
6
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0
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Understanding and eliminating defects in electroplated Cu films
2001
IITC | International Interconnect Technology Conference
Jiong-Ping Lu
L. Chen
D. González
H. L. Guo
D. J. Rose
M. Marudachalam
W.U. Hsu
H. Y. Liu
F. Cataldi
Basab Chatterjee
Patricia B. Smith
P. J. Holverson
Richard L. Guldi
N.M. Russell
Gregory B. Shinn
S. Zuhoski
J.D. Luttmer
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Citations (5)
Marathon and IRONMAN/sup TM/ testing of the Trikon Technologies Sigma ForceFill/sup TM/
1997
ASMC | Advanced Semiconductor Manufacturing Conference
J. Strupp
D. González
D. McKeon
M. Saran
R. Mena
S. Zuhoski
P. Niemyski
P. J. Holverson
N. Carrington
D. Butler
C. Dobson
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Marathon and IRONMANTM testing of the Trikon Technologies Sigma ForceFillTM
1997
Advanced Semiconductor Manufacturing Conference
Joel Strupp
D Lombrana Gonzalez
Donald C. McKeon
M. Saran
Rafael A. Mena
Steven P. Zuhoski
P. Niemyski
P. J. Holverson
N. Carrington
Deborah L. Butler
Christopher M. Dobson
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Application of force fill Al-plug technology to 64 Mb DRAM and 0.35 /spl mu/m logic
1995
VLSIT | Symposium on VLSI Technology
K. Mizobuchi
K. Hamamoto
M. Utsugi
Girish A. Dixit
Scott Poarch
Robert H. Havemann
Christopher David Dobson
A.I. Jeffryes
P. J. Holverson
Paul Rich
D. C. Butler
Nick Rimmer
Arthur John McGeown
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A novel high pressure low temperature aluminum plug technology for sub-0.5 /spl mu/m contact/via geometries
1994
IEDM | International Electron Devices Meeting
Girish A. Dixit
Michael Francis Chisholm
Manoj K. Jain
T. Weaver
Larry M. Ting
S. Pearch
K. Mizobuchi
Robert H. Havemann
C D Dobson
A.I. Jeffryes
P. J. Holverson
Paul Rich
D.C. Butler
J. Hems
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