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Kazuhiro Nakahira
Kazuhiro Nakahira
Composite material
Materials science
Electronic packaging
Integrated circuit packaging
Epoxy
3
Papers
24
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High reliability MCM packaging using low stress liquid type epoxy resin by printing encapsulation systems (PES)
1994
ECTC | Electronic Components and Technology Conference
Atsushi Okuno
Koichirou Nagai
Noriko Fujita
Yoskitaka Tsukasaki
Noritaka Oyama
Kazuhiro Nakahira
Tstmekazu Hashimoto
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New packaging of a chip on a board by a unique printing method
1992
ECTC | Electronic Components and Technology Conference
Atsushi Okuno
Koichiro Nagai
Kazuhiro Ikeda
Yoshitaka Tsukasaki
Noritaka Oyama
Kazuhiro Nakahira
Tsunekazu Hashimoto
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Citations (13)
New packaging of chip-on-board by unique printing method
1991
ECTC | Electronic Components and Technology Conference
Atsushi Okuno
Koichiro Nagai
Kazuhiro Ikeda
T. Tsukazaki
Noritaka Oyama
Kazuhiro Nakahira
Tsunekazu Hashimoto
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Citations (10)
1