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Tsunekazu Hashimoto
Tsunekazu Hashimoto
Composite material
Electronic engineering
Materials science
Epoxy
Encapsulation (computer programming)
6
Papers
44
Citations
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Properties and reliability of liquid epoxy resin for LSI fabrication with the printing encapsulation system (PES)
1997
Electronics and Communications in Japan Part Ii-electronics
Atsushi Okuno
Noriko Fujita
Koichiro Nagai
Noritaka Oyama
Tsunekazu Hashimoto
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Flip-chip packaging using PES (Printing Encapsulation Systems) and PES underfill epoxy resin
1995
ECTC | Electronic Components and Technology Conference
Atsushi Okuno
Noritaka Oyama
Koichiro Nagai
Tsunekazu Hashimoto
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New metal board for COB, Multi-Chip Module, TAB and Phlip-Chip
1993
ECTC | Electronic Components and Technology Conference
A. Okuno
N. Oyama
Tsunekazu Hashimoto
H. Kinoshita
H Shida
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New packaging of a chip on a board by a unique printing method
1992
ECTC | Electronic Components and Technology Conference
Atsushi Okuno
Koichiro Nagai
Kazuhiro Ikeda
Yoshitaka Tsukasaki
Noritaka Oyama
Kazuhiro Nakahira
Tsunekazu Hashimoto
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Citations (13)
Printing encapsulation systems (PES) of advanced multichip module and COB device
1992
ECTC | Electronic Components and Technology Conference
Atsushi Okuno
Koichiro Nagai
Noritaka Oyama
Tsunekazu Hashimoto
T. Onishi
S. Wakamoto
K. Masui
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Citations (11)
1