New packaging of chip-on-board by unique printing method

A novel printing method which has been found to be successful in making the chip-on-board (COB) packaging for ICs has been developed. Using this technique, it has become possible to achieve less than mm height, uniform thickness, and all-in-one operation. This method is more economical than the transfer-molding method. In addition, the cost of packages is much reduced, and it is more suited to mass production. One-component epoxy-resin, called NPR-150, has been developed which is suitable for printing. Deformation of gold wires was not observed, and reliability test results showed excellent levels, comparable to the formal transfer-molding packaging. >