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Noriko Fujita
Noriko Fujita
Ball grid array
Encapsulation (computer programming)
Epoxy
Materials science
Composite material
5
Papers
15
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High reliability, high density, low cost packaging systems for matrix systems for matrix BGA and CSP by vacuum printing encapsulation systems (VPES)
1999
IEEE Transactions on Advanced Packaging
Atsushi Okuno
Noriko Fujita
Yuki Ishikawa
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Citations (13)
Properties and reliability of liquid epoxy resin for LSI fabrication with the printing encapsulation system (PES)
1997
Electronics and Communications in Japan Part Ii-electronics
Atsushi Okuno
Noriko Fujita
Koichiro Nagai
Noritaka Oyama
Tsunekazu Hashimoto
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PES (Printing Encapsulation Systems) for Some BGA Packagings
1996
Aki Okuno
Noriko Fujita
Keiko Ikeda
Kazuki Nagai
Yukihiro Tsukasaki
Naoyuki Oyama
Katsuko T. Nakahira
Takashi Hashimoto
Mark A. Robertson
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High &liability MCM Packaging using Low Stress Liquid Printing Encapsulation wtems (PES) Epoxy Resin by
1994
Atsushi Okm
Koichirou Nagai
Noriko Fujita
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High reliability MCM packaging using low stress liquid type epoxy resin by printing encapsulation systems (PES)
1994
ECTC | Electronic Components and Technology Conference
Atsushi Okuno
Koichirou Nagai
Noriko Fujita
Yoskitaka Tsukasaki
Noritaka Oyama
Kazuhiro Nakahira
Tstmekazu Hashimoto
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