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Takashi Sakuma
Takashi Sakuma
Chemical vapor deposition
Metallurgy
Materials science
Electrical resistivity and conductivity
Copper
4
Papers
18
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Bottom up deposition of advanced iPVD Cu process integrated with iPVD Ti and CVD Ru
2012
Microelectronic Engineering
Tadahiro Ishizaka
Takashi Sakuma
Masaya Kawamata
Osamu Yokoyama
Takara Kato
Atsushi Gomi
Chiaki Yasumuro
Hiroyuki Toshima
Toshihiko Fukushima
Yasushi Mizusawa
Tatsuo Hatano
Masamichi Hara
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Cu dry-fill on CVD Ru liner for advanced gap-fill and lower resistance
2011
IITC | International Interconnect Technology Conference
Tadahiro Ishizaka
A. Gomi
Takara Kato
Takashi Sakuma
Osamu Yokoyama
C. Yasumuro
H. Toshima
Yasushi Mizusawa
Tatsuo Hatano
Cheonsoo Han
Masamichi Hara
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Procédé de filmage et système de traitement
2008
Taro Ikeda
Satoshi Wakabayashi
Kensaku Narushima
Tatsuo Hatano
Yasushi Mizusawa
Osamu Yokoyama
Takashi Sakuma
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Procédé et appareil de formation de film, programme informatique et support de stockage
2007
Taro Ikeda
Yasushi Mizusawa
Takashi Sakuma
Osamu Yokoyama
Tatsuo Hatano
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