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T. Eiles
T. Eiles
Intel
Electronic engineering
Transistor
Reliability (semiconductor)
Engineering
Thermal copper pillar bump
2
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83
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0.02
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Self-heat reliability considerations on Intel's 22nm Tri-Gate technology
2013
IRPS | International Reliability Physics Symposium
C. Prasad
Lei Jiang
D. Singh
M. Agostinelli
C. Auth
P. Bai
T. Eiles
J. Hicks
C-H Jan
K. Mistry
S. Natarajan
B. Niu
P. Packan
Daniel Pantuso
I. Post
S. Ramey
Anthony Schmitz
Bernhard Sell
S. Suthram
J. Thomas
Curtis Tsai
P. Vandervoorn
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Citations (56)
Optical probing of flip-chip-packaged microprocessors
2000
ISSCC | International Solid-State Circuits Conference
T. Eiles
G. Woods
V Rao
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Citations (27)
1