Self-heat reliability considerations on Intel's 22nm Tri-Gate technology

C. Prasad,Lei Jiang,D. Singh,M. Agostinelli,C. Auth,P. Bai,T. Eiles,J. Hicks,C-H Jan,K. Mistry,S. Natarajan,B. Niu,P. Packan,Daniel Pantuso,I. Post,S. Ramey,Anthony Schmitz,Bernhard Sell,S. Suthram,J. Thomas,Curtis Tsai,P. Vandervoorn

Self-heat reliability considerations on Intel's 22nm Tri-Gate technology

2013

This paper describes various measurements on self-heat performed on Intel's 22nm process technology, and outlines its reliability implications. Comparisons to thermal modeling results and analytical data show excellent matching.

Keywords:

Reliability (semiconductor)
Electronic engineering
Transistor
Engineering

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