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Jenn An Wang
Jenn An Wang
Materials science
Mechanical engineering
Predictive modelling
Heat transfer
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4
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2
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Warpage of Compression Molded SiP Strips
2021
ECTC | Electronic Components and Technology Conference
Eric Ouyang
YongHyuk Jeong
JaeMyong Kim
Jae Pil Kim
Ohyoung Kwon
Michael Liu
Susan Lin
Jenn An Wang
Anthony D. Yang
Eric Yang
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Predictive Modelling Methodologies for Bi-Material Wafer Warpage
2021
ICEP | International Conference on Electronics Packaging
Kang Eu Ong
Wei Keat Loh
Jenn An Wang
Arvind Purushotaman
Tatsuro Yoshida
Kei Murayama
Makoto Tsukahara
Ron W. Kulterman
Haley Fu
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Predictive Modelling Methodologies for Bi-material Strip Warpage
2020
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Jenn An Wang
Ong Kang Eu
Wen-Hsin Weng
Chih-Chung Hsu
Wei Keat Loh
Ron W. Kulterman
Haley Fu
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Molded Electronic Package Warpage Predictive Modelling Methodologies
2019
ICEP | International Conference on Electronics Packaging
Kang Eu Ong
Wei Keat Loh
Ron W. Kulterman
Chih-Chung Hsu
Jenn An Wang
Haley Fu
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Citations (2)
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