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JaeMyong Kim
JaeMyong Kim
Mechanical engineering
Composite material
System in package
Materials science
Computer science
5
Papers
8
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Warpage of Compression Molded SiP Strips
2021
ECTC | Electronic Components and Technology Conference
Eric Ouyang
YongHyuk Jeong
JaeMyong Kim
Jae Pil Kim
Ohyoung Kwon
Michael Liu
Susan Lin
Jenn An Wang
Anthony D. Yang
Eric Yang
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Warpage Behaviors of System-in-Packages on a Substrate Strip
2018
Eric Ouyang
Billy Ahn
SeonMo Gu
Jim Hsu
YongHyuk Jeong
JaeMyong Kim
Susan Lin
Goran Liu
Anthony D. Yang
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Behaviors of QFN Packages on a Leadframe Strip
2016
Eric Ouyang
Billy Ahn
Seng Guan Chow
Anonuevo Dexter
SeonMo Gu
YongHyuk Jeong
JaeMyong Kim
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Citations (3)
A Basic Guideline for Non-native EFL Teachers to Select Authentic English from the Web
1999
Multimedia-Assisted Language Learning
JaeMyong Kim
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