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YongHyuk Jeong
YongHyuk Jeong
Composite material
Materials science
Electronic engineering
Flip chip
Thermocouple
5
Papers
20
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Warpage of Compression Molded SiP Strips
2021
ECTC | Electronic Components and Technology Conference
Eric Ouyang
YongHyuk Jeong
JaeMyong Kim
Jae Pil Kim
Ohyoung Kwon
Michael Liu
Susan Lin
Jenn An Wang
Anthony D. Yang
Eric Yang
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Warpage Behaviors of System-in-Packages on a Substrate Strip
2018
Eric Ouyang
Billy Ahn
SeonMo Gu
Jim Hsu
YongHyuk Jeong
JaeMyong Kim
Susan Lin
Goran Liu
Anthony D. Yang
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Behaviors of QFN Packages on a Leadframe Strip
2016
Eric Ouyang
Billy Ahn
Seng Guan Chow
Anonuevo Dexter
SeonMo Gu
YongHyuk Jeong
JaeMyong Kim
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Citations (3)
Optimization of Compression Bonding Processing Temperature for Fine Pitch Cu-Column Flip Chip Devices
2014
ECTC | Electronic Components and Technology Conference
YongHyuk Jeong
Joonyoung Choi
Youjoung Choi
Nokibul Islam
Eric Ouyang
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Thermal Characterization and Simulation of a fcBGA-H device
2012
Eric Ouyang
Weikun He
YongHyuk Jeong
MyoungSu Chae
SeonMo Gu
Gwang Kim
Billy Ahn
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