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Ron W. Kulterman
Ron W. Kulterman
Materials science
Predictive modelling
Heat transfer
Mechanical engineering
electronic packages
4
Papers
3
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0
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Predictive Modelling Methodologies for Bi-Material Wafer Warpage
2021
ICEP | International Conference on Electronics Packaging
Kang Eu Ong
Wei Keat Loh
Jenn An Wang
Arvind Purushotaman
Tatsuro Yoshida
Kei Murayama
Makoto Tsukahara
Ron W. Kulterman
Haley Fu
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Predictive Modelling Methodologies for Bi-material Strip Warpage
2020
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Jenn An Wang
Ong Kang Eu
Wen-Hsin Weng
Chih-Chung Hsu
Wei Keat Loh
Ron W. Kulterman
Haley Fu
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Impact of Low Temperature Solder on Electronic Package Dynamic Warpage Behavior and Requirement
2019
ECTC | Electronic Components and Technology Conference
Wei Keat Loh
Ron W. Kulterman
Haley Fu
Chih-Chung Hsu
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Molded Electronic Package Warpage Predictive Modelling Methodologies
2019
ICEP | International Conference on Electronics Packaging
Kang Eu Ong
Wei Keat Loh
Ron W. Kulterman
Chih-Chung Hsu
Jenn An Wang
Haley Fu
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Citations (2)
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