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H.H. Lee
H.H. Lee
TSMC
Materials science
Electronic engineering
Interconnection
Dielectric
Metallurgy
2
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A flexible top metal structure to improve ultra low-k reliability
2015
IITC | International Interconnect Technology Conference
K. F. Cheng
C. L. Teng
H. Y. Huang
Hsien-Wei Chen
C.W. Shih
T. H. Liu
Cheng-Hsiung Tsai
C. W. Lu
Y.H. Wu
H.H. Lee
Ming-Han Lee
M.-H. Hsieh
B. L. Lin
Shang-Yun Hou
Chung-Ju Lee
H.H. Lu
Tien-I Bao
Shau-Lin Shue
Chen-Hua Yu
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Uncured ELK as a chemical mechanical planarization stop layer in Cu/XLK interconnect
2012
IITC | International Interconnect Technology Conference
Y.H. Wu
Ming-Han Lee
Cheng-Hsiung Tsai
H.H. Lee
Chung-Ju Lee
H.H. Lu
Tien-I Bao
Shau-Lin Shue
Chen-Hua Yu
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