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H.H. Lu

TSMC

4

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6

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A flexible top metal structure to improve ultra low-k reliability

2015 IITC | International Interconnect Technology Conference
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Uncured ELK as a chemical mechanical planarization stop layer in Cu/XLK interconnect

2012 IITC | International Interconnect Technology Conference
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Low capacitance approaches for 22nm generation Cu interconnect

2009 VLSI-TSA | International Symposium on VLSI Technology, Systems, and Applications
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Challenges of Low Effective-K approaches for future Cu interconnect

2009 IITC | International Interconnect Technology Conference
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