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B. L. Lin
B. L. Lin
TSMC
Engineering
Electronic engineering
Electromigration
Analytical chemistry
Metal
5
Papers
28
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A flexible top metal structure to improve ultra low-k reliability
2015
IITC | International Interconnect Technology Conference
K. F. Cheng
C. L. Teng
H. Y. Huang
Hsien-Wei Chen
C.W. Shih
T. H. Liu
Cheng-Hsiung Tsai
C. W. Lu
Y.H. Wu
H.H. Lee
Ming-Han Lee
M.-H. Hsieh
B. L. Lin
Shang-Yun Hou
Chung-Ju Lee
H.H. Lu
Tien-I Bao
Shau-Lin Shue
Chen-Hua Yu
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Thermal behavior of self-heating effect in FinFET devices acting on back-end interconnects
2015
IRPS | International Reliability Physics Symposium
C. W. Chang
S. E. Liu
B. L. Lin
C.C. Chiu
Y.-H. Lee
Kaichun Wu
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Citations (19)
Cu Interconnect Width Effect, Mechanism and Resolution on Down-Stream Stress Electromigration
2007
IRPS | International Reliability Physics Symposium
Yi Lung Cheng
B. L. Lin
S. Y. Lee
C.C. Chiu
Kenneth Wu
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Citations (8)
The Impact of Ball-Bonding Induced Voltage Transient on Sub-90nm CMOS Technology
2007
IRPS | International Reliability Physics Symposium
Jian-Hsing Lee
J.R. Shih
B. L. Lin
C. H. Lin
Pao-Kang Niu
Jerry Wang
Chin-Hsin Tang
Tony Oates
Kenneth Wu
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Citations (1)
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