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Rajesh Jain

3

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Backside E-Beam Probing on Nano scale devices

2007 ITC | International Test Conference
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Non destructive 3D chip inspection with nano scale potential by use of backside FIB and backscattered electron microscopy

2007 Microelectronics Reliability
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FIB etching of Cu with minimal impact on neighboring circuitry, including dielectric

2005 IPFA | International Symposium on the Physical and Failure Analysis of Integrated Circuits
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