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Tahir Malik
Tahir Malik
Electronic engineering
Chip
Nanoscopic scale
Engineering
Backscatter
3
Papers
17
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The Copper Challenge to Circuit Edit
2011
Tahir Malik
Ted R. Lundquist
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Backside E-Beam Probing on Nano scale devices
2007
ITC | International Test Conference
Rudolf Schlangen
R. Leihkauf
Uwe Kerst
Christian Boit
Rajesh Jain
Tahir Malik
Keneth R. Wilsher
Ted R. Lundquist
Bernd Krüger
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Citations (10)
Non destructive 3D chip inspection with nano scale potential by use of backside FIB and backscattered electron microscopy
2007
Microelectronics Reliability
Rudolf Schlangen
Uwe Kerst
Christian Boit
Tahir Malik
Rajesh Jain
Ted R. Lundquist
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Citations (7)
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