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Matthias Heschel

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Application and RF performance of integrated resistor structures on non-planar topologies in micro-machined silicon packages for transmitter optical subassemblies

2006 ECTC | Electronic Components and Technology Conference
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Ultra thin hermetic wafer level, chip scale package

2006 ECTC | Electronic Components and Technology Conference
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Optimized Micro-Via Technology for High Density and High Frequency (>40GHz) HermeticThrough-Wafer Connections in Silicon

2005 ECTC | Electronic Components and Technology Conference
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