Old Web
English
Sign In
Acemap
>
authorDetail
>
Andreas Alfred Hase
Andreas Alfred Hase
Electronic engineering
Materials science
Microelectromechanical systems
Wafer
Soldering
3
Papers
14
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (2)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Ultra thin hermetic wafer level, chip scale package
2006
ECTC | Electronic Components and Technology Conference
Lior Shiv
Matthias Heschel
H. Korth
Steen Weichel
Ralf Hauffe
Arnd Kilian
B. Semak
M. Houlberg
P. Egginton
Andreas Alfred Hase
Jochen Kuhmann
Show All
Source
Cite
Save
Citations (7)
Optimized Micro-Via Technology for High Density and High Frequency (>40GHz) HermeticThrough-Wafer Connections in Silicon
2005
ECTC | Electronic Components and Technology Conference
Ralf Hauffe
Arnd Kilian
Marcus Winter
Lior Shiv
G. Elger
Matthias Heschel
Jochen Kuhmann
S. Isaacs
Steen Weichel
P. Gaal
H. Korth
Andreas Alfred Hase
Show All
Source
Cite
Save
Citations (3)
1