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B. Semak
B. Semak
Materials science
Soldering
Chip-scale package
Electronic engineering
Small form factor
2
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7
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0
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Ultra thin hermetic wafer level, chip scale package
2006
ECTC | Electronic Components and Technology Conference
Lior Shiv
Matthias Heschel
H. Korth
Steen Weichel
Ralf Hauffe
Arnd Kilian
B. Semak
M. Houlberg
P. Egginton
Andreas Alfred Hase
Jochen Kuhmann
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Citations (7)
Kompleksowa ocena wlasciwosci mechanicznych wielowarstwowych tekstylnych materialow obuwniczych
1995
N Bednarczuk
I Galyk
B. Semak
U Stelmach
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