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Juergen Burggraf
Juergen Burggraf
EV Group
Materials science
Wafer
Wafer bonding
Composite material
Adhesive
6
Papers
11
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Critical Process Parameters And Failure Analysis For Temporary Bonded Wafer Stacks
2016
Elisabeth Brandl
Karine Abadie
Markus Wimplinger
Juergen Burggraf
Thomas Uhrmann
Julian Bravin
Frank Fournel
Pierre Montmeat
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Low Temperature Wafer Bonding for 3D Applications
2014
Juergen Burggraf
Julian Bravin
Harald Wiesbauer
Viorel Dragoi
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Low Temperature Fusion Wafer Bonding for Wafer-Level 3D Integration Applications
2013
Juergen Burggraf
Julian Bravin
Harald Wiesbauer
Viorel Dragoi
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Room temperature debonding — An enabling technology for TSV and 3D integration
2012
EPTC | Electronics Packaging Technology Conference
Thorsten Matthias
Frank Huysmans
Juergen Burggraf
Daniel Burgstaller
Paul Lindner
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Room temperature debonding — An enabling technology for TSV and 3D integration
2012
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Thorsten Matthias
Günter Pauzenberger
Juergen Burggraf
Daniel Burgstaller
Paul Lindner
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Citations (7)
Room Temperature Debonding - An Enabling Technology for TSV and 3D Integration
2012
Electronics Packaging Technology Conference
Thorsten Matthias
Eric Pabo
Juergen Burggraf
Daniel Burgstaller
Markus Wimplinger
Paul Lindner
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