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Frank Huysmans
Frank Huysmans
EV Group
Materials science
Composite material
Adhesive
Aspect ratio (image)
Soldering
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Room temperature debonding — An enabling technology for TSV and 3D integration
2012
EPTC | Electronics Packaging Technology Conference
Thorsten Matthias
Frank Huysmans
Juergen Burggraf
Daniel Burgstaller
Paul Lindner
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