Room temperature debonding — An enabling technology for TSV and 3D integration

ZoneBOND™ is a revolutionary breakthrough in thin wafer processing. It enables room temperature debonding method, which is independent from the properties of the temporary adhesive. Thereby it enables a standardization of the debonding process and debonding equipment as it is material independent. The ZoneBOND™ Open Platform enables a versatile supply chain with multiple adhesive suppliers.