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U. Scholz
U. Scholz
Bosch
Electronic engineering
Materials science
Molding (process)
Compression molding
Printed circuit board
3
Papers
43
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Through mold via technology for multi-sensor stacking
2012
EPTC | Electronics Packaging Technology Conference
T. Braun
M. Bründel
K.-F. Becker
R. Kahle
K. Piefke
U. Scholz
Frieder Haag
V. Bader
S. Voges
T. Thomas
R. Aschenbrenner
K.-D. Lang
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Citations (15)
Substrateless sensor packaging using wafer level fan-out technology
2012
EPTC | Electronics Packaging Technology Conference
M. Briindel
U. Scholz
Frieder Haag
E. Graf
T. Braun
K.-F. Becker
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Citations (4)
Large area embedding for heterogeneous system integration
2010
ECTC | Electronic Components and Technology Conference
T. Braun
K.-F. Becker
Lars Böttcher
J. Bauer
T. Thomas
M. Koch
R. Kahle
A. Ostmann
R. Aschenbrenner
H. Reichl
M. Bründel
J. F. Haag
U. Scholz
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Citations (24)
1