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E. Graf
E. Graf
Bosch
Electronic engineering
Materials science
Packaging engineering
Application-specific integrated circuit
Pressure sensor
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Substrateless sensor packaging using wafer level fan-out technology
2012
EPTC | Electronics Packaging Technology Conference
M. Briindel
U. Scholz
Frieder Haag
E. Graf
T. Braun
K.-F. Becker
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Citations (4)
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